Smoltek has been granted three new patents

Smoltek’s 66th pat­ent was gran­ted in China and it fur­ther strengthens the pos­i­tion of our growth-related pat­ent fam­ily of Inter­con­nects in the form­ing of nano­struc­tures and nano­struc­ture devices.

“Through these three new pat­ents, Smol­tek again proves our abil­ity both in tech­nic­al and innov­at­ive cap­ab­il­it­ies of widen­ing our IP foot­print,” says Vin­cent Des­mar­is, CTO at Smoltek.

Smoltek’s 67th pat­ent has been gran­ted in Japan and relates to the Assembly plat­form fam­ily in the field of inter­con­nects and het­ero­gen­eous integ­ra­tion. This par­tic­u­lar pat­ent fam­ily is a path­way to tap into the ever-increas­ing demand for mini­atur­iz­a­tion of elec­tron­ic com­pon­ents and inter­con­nect them in the form of an assembly to min­im­ize foot­print at the pack­aging level.

Smoltek’s 68th pat­ent has been gran­ted in the US and is cov­er­ing the concept and man­u­fac­tur­ing of extremely thin energy stor­age devices embed­ded in an inter­poser. Our energy stor­age device con­cepts may take many forms e.g. dis­crete, integ­rated or it can take the form where the end res­ult is an inter­poser with CNF-MIM capa­cit­ors embed­ded in it. And the Com­pact energy stor­age inter­poser fam­ily is developed to cap­ture around that concept.

Smoltek’s pat­ent port­fo­lio now glob­ally com­prises 68 gran­ted pat­ents. Read more about our IP and patents.

Image: Smol­tek CTO, Vin­cent Desmaris