Reliability, solderability and electrical performance of high density ultra thin capacitors based on carbon nanofibers

This paper inves­ti­gates the suit­abil­i­ty of the Car­bon Nano-Fiber Met­al-Insu­la­tor-Met­al (CNF-MIM) capac­i­tor for inte­gra­tion in future minia­tur­ized elec­tron­ics. The CNF-MIM has pre­vi­ous­ly shown elec­tri­cal prop­er­ties suit­able for use in a vari­ety of appli­ca­tions such as dig­i­tal elec­tron­ics. The CNF-MIM capac­i­tors are sub­ject­ed to high ambi­ent tem­per­a­ture and con­stant volt­age bias envi­ron­ments over long peri­ods of time to assess their long-term dura­bil­i­ty. The devices are also sub­ject­ed to stan­dard sur­face-mount sol­der reflow pro­ce­dure to inves­ti­gate the com­pat­i­bil­i­ty with indus­try-stan­dard assem­bly tech­niques. The capac­i­tors are char­ac­ter­ized in both DC and RF and are shown to be robust against degra­da­tion in these sce­nar­ios. Final­ly, ultra-thin CNF-MIM capac­i­tors are man­u­fac­tured, show­ing that the estab­lished tech­nol­o­gy can be fur­ther shrunk for fur­ther minia­tur­iza­tion and future applications.