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We are very happy to be featured in IEEE Spectrum. IEEE Spectrum is the flagship magazine and website of the IEEE, the world’s largest professional organization devoted to engineering and the applied sciences....
Complete on-chip fully solid-state 3D integrated capacitors using vertically aligned carbon nanofibers as electrodes to provide a large 3D surface in a MIM configuration have been manufactured and characterized in terms of capacitance per device footprint area, equivalent series resistance (ESR), breakdown voltage and leakage current. The entire manufacturing process of the capacitors is completely CMOS compatible,...
...carbon nanotube based structure is compared to a previously fabricated Si-based device and to simulations. Read more S Rahiminejad, A M Saleem, V Desmaris, P Enoksson S Rahiminejad, A M Saleem, V Desmaris, P Enoksson S Rahiminejad, A M Saleem, V Desmaris, P Enoksson S Rahiminejad, A M Saleem, V Desmaris, P Enoksson S Rahiminejad, A M Saleem, V Desmaris, P Enoksson S Rahiminejad, A M Saleem, V Desmaris, P Enoksson S Rahiminejad, A M Saleem, V Desmaris, P Enoksson S Rahiminejad, A M Saleem, V Desmaris,...
...the active geometrical surface at sweep rate 20 mV/s (Table 1). Calculated capacitances are from the voltammogram values, where the capacitance is the absolute value between ‑0.1 – 0.1 V divided by 2 and divided by the sweep rate. C = Δ|I| / s, where Δ|I| is the difference in current, s is the sweep rate (dE/dt) and C is the...
The renaming of the subsidiary is a logical next step when the innovation project around materials for electrolyzers and green hydrogen is now its own independent business area within Smoltek, and the new company name shows that we are committed to the ambition to provide the new hydrogen economy with decisive technology.1 “The global hydrogen market...
In recent years, Smoltek has mainly focused on its CNF-MIM technology for production of miniaturized capacitors. In the company’s assessment, this technology has now reached the level of maturity necessary for signing licensing agreements in the semiconductor and electronics industry. Smoltek’s broad technology platform, accompanied by an extensive patent portfolio, has also opened new possibilities...
...advanced packaging architectures for integrated circuits,. The present patented concepts are built on the need to improve circuit performance by enabling a compact energy storage to be fabricated and embedded into an interposer substrate. Smoltek’s patent portfolio now globally comprises 71 granted patents. Fredrik Liljeberg 0 0 Smoltek patent No. 71 now granted – Smoltek Smoltek’s 71st...
Smoltek COO, Ola Tiverman is primarily managing sales and business development, share his thoughts about our business strategies regarding licensing and customer projects. Video:Ola Tiverman comments on CNF-MIM evaluation licensing agreements Image: Ola Tiverman, COO at Smoltek Fredrik Liljeberg...
The prize includes travel expenses to the Electronic Components and Technology Conference (ECTC) in Florida between May 30 – June 2. Muhammad Amin will make a presentation about the winning abstract on May 31 at 10:25 AM. ECTC is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and...