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...our compact energy storage interposer family is complementary to our Interposer family, and offers an alternative path to utilize our CNF-MIM technology primarily to manufacture interposers. The beauty of our concept is that it facilitates to make an interposer smarter with added functionality embedded within the interposer. Quite mindboggling, actually”, says Farzan Ghavanini, CTO and...
...engineering problems in many other industrial sectors. For instance, the technology is used to miniaturize capacitors for the semiconductor industry and manufacture new cellular materials for membranes in electrolyzers for fossil-free hydrogen production. global-field post_title global-field post_excerpt global-field featured_img global-field post_date global-field blogname global-field site_logo custom-field custom-field custom-field custom-field custom-field S Kabir, V Desmaris, A Johansson 0 0 22...
A bright and airy photorealistic image of a single sports car on a road next to the sea where a single cargo ship passes by while a single airplane flies over the sea. The road winds through a lush green landscape with wind turbines and solar panels inland. Thomas Barregren ...
The IMAPS 2020 all virtual symposium consisted of over 75 technical presentations across 5 tracks and 17 session categories. The presentations was available for on-demand viewing complemented by a live Q&A session. At the symposium R&D engineer Victor Marknäs presented the Smoltek paper: “Electrical performance and robustness of ultra thin high-density carbon nano fiber capacitors on silicon,...
...Research Engineer Muhammad Amin Saleem Ph.D. is attending. 23 October Nanoforum, Uppsala Sweden COO, Ola Tiverman is attending. This was a brief presentation of what we have in front of us in the start of the fall. We’ll be back with more information as soon as we have something to announce. Meanwhile, you are welcome to...
Vertically aligned carbon nanofibers (VACNFs) turf are characterized electrically and mechanically for prospective on-chip applications. The CNFs turf of 10 micrometer diameter and 20 micrometer pitch are fabricated at high temperature (550 °C) and CMOS compatible temperatures (390 °C) directly on silicon substrates where the number of CNFs per μm2 area are 13 and 38 for the respective growth...
...S/m. The average input power before interconnect destruction is larger than 25W with effective device diameter ranging from 3 µm to 100 µm interconnects. In addition, the average gain compression before interconnect destruction was found to be 0.6 dB. It was not possible to extract the conductivity value of an individual nanofiber using comparison to simulation data, since...
...towards a shared vision and objectives. Previously Interim SVP Sales & Strategy of Next Biometrics, CEO of Neonode and CEO of Precise Biometrics. Education: B.Sc. Business Administration, University of Lund Ellinor Ehrnberg President of Smoltek Hydrogen Ellinor Ehrnberg has over 30 years of experience from various global roles in innovation, business development, strategy, company acquisitions, research, sales and business...
At the end of March this year, Smoltek announced that the company had signed an evaluation agreement with one of the world’s largest capacitor manufacturers. The agreement, which relates to a license where the company’s patented carbon nanofiber-based CNF-MIM technology is evaluated through a joint project, was originally intended to run until the end of August this...
One-dimensional carbon nanostructures have been known and fabricated for more than a hundred years and were originally rWe describe a fast and cost-effective process for the growth of carbon nanofibers (CNFs) at a temperature compatible with complementary metal oxide semiconductor technology, using highly stable polymer–Pd nanohybrid colloidal solutions of Cellulose-based carbon nanofibers (CNFs) with high mechanical strength and...
...and again showcase the great disruptive potential of our technology platform.”, says Farzan Ghavanini, CTO at Smoltek. In the context of our Assembly platform and interconnects, the present applications concepts take advantage of the wettability properties of nanostructures to form small sized composite interconnect bumps together with traditional solder/metal materials. Such composite interconnects provide a means...