MEPTEC´s Semiconductor Packaging Symposium

Smol­tek is engaged in the event as a spon­sor, but will also be exhib­it­ing. CEO Anders Johans­son and CTO Vin­cent Des­mar­is will rep­res­ent the com­pany at the symposium.

“Smoltek’s dis­rupt­ive car­bon nan­o­tech­no­logy moves the bench­mark and provides com­pletely new oppor­tun­it­ies for man­u­fac­tur­ing of het­ero­gen­eously integ­rated cir­cuits. We are very much look­ing for­ward to once again take part in MEPTEC’s Semi­con­duct­or Pack­aging Sym­posi­um,” says Anders Johansson.

The sym­posi­um will explore cur­rent chal­lenges and pos­sib­il­it­ies in the semi­con­duct­or industry under the tagline “Het­ero­gen­eous Integ­ra­tion – a road to imple­ment­a­tion”. The event will explore three issues cent­ral to the suc­cess­ful exe­cu­tion of het­ero­gen­eous integ­rated packages:

• Can the pack­aging com­munity estab­lish a real design for het­ero­gen­eous integ­rated ecosystem?

• Should we rethink the reli­ab­il­ity stand­ards for these het­ero­gen­eous integ­rated SIP packages?

• What are the best test strategies for these het­ero­gen­eous integ­ra­tions, or at least what arethe guid­ing principles?