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Article published in Chip Scale Review, Jul–Aug, 2017, pp. 38–40.
Chip Scale Review is a global magazine covering device and wafer-level test, assembly, and packaging and covers high-density interconnection technologies including 3D packages, MEMS, and other wafer-fabricated devices. The magazine showcases the industry with exclusive editorial content that includes in-depth technical articles by industry technologists, market forecasts and updates from research institutions.
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