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Bumping
The Bumping family is an apparatus connecting and bonding adjacent layers with nanostructures.
The invention: An apparatus comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.
Granted patents relating to the innovation
| Patent Office | Patent |
|---|---|
| China | CN101827782 |
| China | CN104600057 |
| Europe | EP2197782 |
| Japan | JP5535915 |
| Japan | JP6149077 |
| South Korea | KR101487346 |
| Taiwan | TWI511208 |
| Taiwan | TWI564980 |
| Taiwan | TWI655695 |
| USA | US8106517 |
| USA | US8253253 |
| USA | US8815332 |
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Related news and insights
Smoltek patent No. 52 now granted
Smoltek has yet another granted patent to add to our extensive IP portfolio. The Taiwanese patent office has issued the Letter of grant for another divisional patent regarding our Bumping technology family.
Nano Imprint Lithography
The Nano Imprint Lithography family is covering a method of making high aspect ratio template, stamp, and imprinting at nanoscale using nanostructures.
Interconnects B
The Interconnects B family is covering how nanostructures can be used as interconnects and/or for dissipating heat from electronic devices.
Nanostructure IC
The Nanostructure IC family is covering a method for the manufacture of an integrated circuit comprising nanostructures.
Interconnects A (SmolGROW™)
The Interconnects A family is covering a method regarding controlled growth of a nanostructure on a substrate, and electron emission devices based on the same.