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Vincent Desmaris At Impas Device Packaging 2020

Smoltek’s carbon based capacitors turns out to be right on target for the semiconductor industry

IMAPS Device Packaging Conference 2020 in Phoenix, Arizona gathered some of the very top semiconductor companies in the world for sharing the latest knowledge of the needs for future technologies. Like ‘How thin can we go?’.

March 6, 2020

Smoltek attend­ed the IMAPS 2020 Device Pack­ag­ing Con­fer­ence March, 2–5 2020, togeth­er with semi­con­duc­tor giants like Sam­sung, Qual­comm and ASE Group. And the main mes­sage of the con­fer­ence was that con­tin­u­ous col­lab­o­ra­tion is nec­es­sary for inno­va­tion as Rich Rice, ASE’s Senor VP of Busi­ness Devel­op­ment, empha­sized in his open­ing keynote.

Fol­low­ing up on the need for inno­va­tion, Chris­t­ian Hoff­mann, prin­ci­pal engi­neer at Qual­comm stat­ed in his keynote that: ”The sin­gle most impor­tant ques­tion for semi­con­duc­tor pack­ages for mobile phones is: How thin can we make it?”

”This res­onates quite well with Smolteks CNF-MIM tech­nol­o­gy as the thick­ness of the active capac­i­tor stack of the CNF-MIM tech­nol­o­gy is in the sin­gle dig­it microm­e­ter range. This ultra- low thick­ness of the active capac­i­tive ele­ment enables Smoltek’s licensees to man­u­fac­ture dis­crete capac­i­tors with an unprece­dent­ed low pro­file.”, Karl Lun­dahl VP Prod­uct Man­age­ments at Smoltek states.

Anders Johans­son, CEO of Smoltek, fills in: “This shows how our car­bon based capac­i­tor con­cept is right on tar­get for the semi­con­duc­tor indus­try, a new dis­rup­tive inno­va­tion that will sup­port con­tin­u­ous devel­op­ment of advanced pack­age architectures.”

Interactive sessions

On Wednes­day March 4, Vin­cent Des­maris, CTO of Smoltek, held an appre­ci­at­ed pre­sen­ta­tion in the pleas­ant Ari­zona after­noon spring. Hov­er­ing Vin­cent and the Smoltek poster were numer­ous curi­ous con­fer­ence atten­dants inquir­ing about the CNF-MIM tech­nol­o­gy and its advan­tages for the pack­ag­ing industry.

Besides the shar­ing the lat­est updates of our capac­i­tor inno­va­tion at the IMAPS Device Pack­ag­ing Con­fer­ence Smoltek also made sev­er­al new and sig­nif­i­cant con­nec­tions with new indus­try entities/​players that can be inter­est­ed for licensing/​development of the CNF-MIM-concept.

“IMAPS in Phoenix gath­ered the right com­pa­nies for one-on-one meet­ings as well as an envi­ron­ment for busi­ness intel­li­gence. And not at least great net­work­ing oppor­tu­ni­ties, all impor­tant for our future jour­ney”, Anders Johans­son, CEO of Smoltek, concluded.

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