Smoltek patent No. 70 now granted

Smoltek’s 70th patent has been grant­ed in Tai­wan and relates to the Assem­bly plat­form fam­i­ly, and this par­tic­u­lar appli­ca­tion is in the field of inter­con­nects and het­ero­ge­neous integration.

Our Assem­bly plat­form patent fam­i­ly is a path­way to tap into the ever-increas­ing demand for minia­tur­iza­tion of elec­tron­ic com­po­nents and inter­con­nect them in the form of an assem­bly to min­i­mize foot­print at the pack­ag­ing level.

“Through this patent grant, we once again demon­strate our tech­ni­cal and inno­v­a­tive abil­i­ty to take advan­tage of the great poten­tial of our tech­nol­o­gy plat­form,” says Karl Lun­dahl, VP Prod­uct man­age­ment & Indus­tri­al­iza­tion at Smoltek.

In the con­text of Assem­bly plat­form and inter­con­nects, the present appli­ca­tions con­cepts take advan­tage of the wet­ta­bil­i­ty prop­er­ties of nanos­truc­tures to form small sized com­pos­ite inter­con­nect bumps togeth­er with tra­di­tion­al solder/​metal mate­ri­als. Such com­pos­ite inter­con­nects pro­vide a means to improve the elec­tri­cal reli­a­bil­i­ty of the solder/​metal bumps since car­bon nanos­truc­tures are inher­ent­ly capa­ble of car­ry­ing high cur­rent at a much small­er footprint.

Smoltek’s patent port­fo­lio now glob­al­ly com­pris­es 70 grant­ed patents. Read more about our IP and patents.

Image: Karl Lun­dahl, VP Prod­uct Man­age­ment & Indus­tri­al­iza­tion at Smoltek