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Smoltek are in discussions about packaging requirements for CNF-MIM capacitors
Smoltek recently visited its Taiwanese partner in advanced microelectronic packaging to discuss the specific requirements for next generations of Smoltek's CNF-MIM (Carbon Nanofiber-Metal Insulator-Metal) capacitors.
December 16, 2024
No semiconductor component is complete without proper packaging, and our CNF-MIM capacitors are no exception.
Dr. Farzan Ghavanini, CTO at Smoltek.
Last week, Dr. Farzan Ghavanini met with Heinz Ru, President and CEO of Tong Hsing Electronics, in Taiwan to continue their discussions. The meeting focused on Smoltek’s CNF-MIM roadmap, including packaging specifications for next generations of CNF-MIM capacitors. This is a continuation of the successful collaboration between the two companies that started earlier this year, where they worked together on Smoltek’s Gen Zero capacitors.
About Tong Hsing
Tong Hsing Electronic industries, based in Taiwan, is a leading global provider in advanced microelectronic packaging services. The company specializes in ceramic substrates, hybrid microelectronics, and advanced packaging solutions, supporting the development of cutting-edge technologies across multiple industries.
People pictured in top photo: Farzan Ghavanini and Taiwan-based Chin Jung Kou from Smoltek together with Heinz Ru of Tong Hsing and colleagues.
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