Smoltek are in discussions about packaging requirements for CNF-MIM capacitors

No semi­con­duc­tor com­po­nent is com­plete with­out prop­er pack­ag­ing, and our CNF-MIM capac­i­tors are no exception.

Dr. Farzan Gha­vani­ni, CTO at Smoltek.

Last week, Dr. Farzan Gha­vani­ni met with Heinz Ru, Pres­i­dent and CEO of Tong Hsing Elec­tron­ics, in Tai­wan to con­tin­ue their dis­cus­sions. The meet­ing focused on Smoltek’s CNF-MIM roadmap, includ­ing pack­ag­ing spec­i­fi­ca­tions for next gen­er­a­tions of CNF-MIM capac­i­tors. This is a con­tin­u­a­tion of the suc­cess­ful col­lab­o­ra­tion between the two com­pa­nies that start­ed ear­li­er this year, where they worked togeth­er on Smoltek’s Gen Zero capacitors.

About Tong Hsing
Tong Hsing Elec­tron­ic indus­tries, based in Tai­wan, is a lead­ing glob­al provider in advanced micro­elec­tron­ic pack­ag­ing ser­vices. The com­pa­ny spe­cial­izes in ceram­ic sub­strates, hybrid micro­elec­tron­ics, and advanced pack­ag­ing solu­tions, sup­port­ing the devel­op­ment of cut­ting-edge tech­nolo­gies across mul­ti­ple industries.

Peo­ple pic­tured in top pho­to: Farzan Gha­vani­ni and Tai­wan-based Chin Jung Kou from Smoltek togeth­er with Heinz Ru of Tong Hsing and colleagues.