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Smoltek are in discussions about packaging requirements for CNF-MIM capacitors
Smoltek recently visited its Taiwanese partner in advanced microelectronic packaging to discuss the specific requirements for next generations of Smoltek's CNF-MIM (Carbon Nanofiber-Metal Insulator-Metal) capacitors.
December 16, 2024
No semiÂconÂducÂtor comÂpoÂnent is comÂplete withÂout propÂer packÂagÂing, and our CNF-MIM capacÂiÂtors are no exception.
Dr. Farzan GhaÂvaniÂni, CTO at Smoltek.
Last week, Dr. Farzan GhaÂvaniÂni met with Heinz Ru, PresÂiÂdent and CEO of Tong Hsing ElecÂtronÂics, in TaiÂwan to conÂtinÂue their disÂcusÂsions. The meetÂing focused on Smoltek’s CNF-MIM roadmap, includÂing packÂagÂing specÂiÂfiÂcaÂtions for next genÂerÂaÂtions of CNF-MIM capacÂiÂtors. This is a conÂtinÂuÂaÂtion of the sucÂcessÂful colÂlabÂoÂraÂtion between the two comÂpaÂnies that startÂed earÂliÂer this year, where they worked togethÂer on Smoltek’s Gen Zero capacitors.
About Tong Hsing
Tong Hsing ElecÂtronÂic indusÂtries, based in TaiÂwan, is a leadÂing globÂal provider in advanced microÂelecÂtronÂic packÂagÂing serÂvices. The comÂpaÂny speÂcialÂizes in ceramÂic subÂstrates, hybrid microÂelecÂtronÂics, and advanced packÂagÂing soluÂtions, supÂportÂing the develÂopÂment of cutÂting-edge techÂnoloÂgies across mulÂtiÂple industries.
PeoÂple picÂtured in top phoÂto: Farzan GhaÂvaniÂni and TaiÂwan-based Chin Jung Kou from Smoltek togethÂer with Heinz Ru of Tong Hsing and colleagues.
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