Sign up for our newsletter!

Subscribe form (en)

No spam. Simply good reading. Get your free subscription to Smoltek Newsletter infrequently delivered straight to your inbox.

Your data will be handled in compliance with our privacy policy.

Photo By Publicdomainpictures

Flip chip interconnects based on carbon nanofibers-solder composites

Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 2229-2234.

In this paper, we pro­pose the intro­duc­tion of ver­ti­cal­ly aligned car­bon nanofibers (CNF) direct­ly grown on the bond­ing pad by chem­i­cal vapor depo­si­tion at CMOS com­pat­i­ble tem­per­a­tures as a solu­tion to rein­force and con­fine the sol­der joint between two chips bond­ed by sol­der. This con­cept poten­tial­ly enables the reduc­tion of pitch­es and size of the sol­der inter­con­nects. The sol­der joints are real­ized by ther­mal com­pres­sion bond­ing tech­nique and the assem­blies are char­ac­ter­ized by means of elec­tri­cal mea­sure­ments of daisy chains and kelvin struc­tures formed by the con­nec­tion of the two chips. Flip chip inter­con­nects based on two sol­der com­pos­ite solu­tions (CNFs/​SnAg and CNFs/​SAC305) are ana­lyzed in terms of elec­tri­cal resis­tance, and dif­fer­ent growth con­di­tions for the CNFs and a post-growth treat­ment have been test­ed. The addi­tion of the car­bon nanofibers to the sol­der led to an addi­tion­al resis­tance low­er than 10 % of the total resis­tance, while pos­si­bly improv­ing the reli­a­bil­i­ty of the joint.

Sign up for our newsletter!

Subscribe form (en)

No spam. Simply good reading. Get your free subscription to Smoltek Newsletter infrequently delivered straight to your inbox.

Your data will be handled in compliance with our privacy policy.

Related news and insights