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Research paper presented in the proceedings of the 53rd International Symposium on Microelectronics, IMAPS 2020, October 5-8, 2020.
We demonstrate the feasibility of implementing carbon nano fiber based metal-insulator-metal (CNFMIM) capacitors on different substrates such as glass, alumina and silicon for use as integrated or discrete passive components on chips or interposers. The effects of biasing voltage and high operating temperatures on the performance of the devices are also investigated. Capacitance densities of 300 nF/mm2 are demonstrated on all substrates at a device thickness of only 5 μm. The manufactured capacitors feature ESR values at or below 100 mΩ, ESL below 15 pH and show little change in capacitance density when subjected to biasing voltage below breakdown and temperatures up to 150°C, making them a promising candidate for both integrated and discrete miniaturized electronic components for future technology.
The paper was presented by Victor Marknäs, Smoltek AB, Gothenburg, Sweden at the 53rd International Symposium on Microelectronics, IMAPS 2020, October 5–8, 2020. Due to covid-19 this was a virtual symposium. Presented by Victor Marknäs, with honors. Presentation awarded the ‘Best of Session Paper’.
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