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The Multilayer Cap patent family introduces a MIM-capacitor device that can double or triple the capacitance density of Smoltek's CNF-MIM capacitors. The patent details an invention for a layered energy storage device, specifically a capacitor, built using a metal-insulator-metal (MIM) configuration.
The Contact Resistance patent family is covering how to improve a separator plate arrangement for an electrochemical cell by comprising a nanostructure which offers lowered contact resistance between the separator element and the diffusion layer.
The Discrete CNF-MIM patent family is covering a method for manufacturing of discrete capacitor components based on our CNF-MIM technology. The innovation exploits the extra-ordinary surface to volume ratio provided by carbon nanofibers to create a MIM capacitor with unparalleled high capacitance density.
Research paper published in the proceedings at ICE 2021, the 3rd International Conference on Electrolysis June 20 – 23, 2022 Golden, Colorado USA.
Research paper published in the proceedings at the 3rd PCNS 7-10th September 2021, Milano, Italy as paper No.5.3. and voted by attendees as: BEST PAPER AWARD.
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 2229-2234.
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1627-1632.
Research paper published in the scientific journal RSC Advances, issue 52 2020.
Research paper presented in the proceedings of the 53rd International Symposium on Microelectronics, IMAPS 2020, October 5-8, 2020.
Research paper published in the proceedings of 2020 IEEE 20th International Conference on Nanotechnology (IEEE-NANO), 2020, pp. 213-216.
Research paper published in the proceedings of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 2139-2144.
Research paper published in the proceedings of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 1614-1619.
Research paper published in the proceedings of 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 2019, pp. 1-3.
Award for best presentation.
Research paper published in the proceedings of 2nd PCNS Passive Components Networking Symposium, Bucharest, Romania, 10–13 September, 2019.
Award for outstanding paper.
Research paper published in the proceedings of 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, pp. 1870-1876.
The Compact Energy Storage Interposer family is covering the invention and manufacturing of extremely thin energy storage devices embedded in an interposer.
Research paper published in the proceedings of 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, pp. 1382–1388.
Research paper published in the proceedings of 2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC), 2018, pp. 1–4.
Research paper published in the proceedings of 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, pp. 2313-2318.
Research paper published in Advanced Materials Letters, 2018, Volume 9, Issue 6, pp. 444–449.