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Multilayer Cap
The Multilayer Cap patent family introduces a MIM-capacitor device that can double or triple the capacitance density of Smoltek's CNF-MIM capacitors. The patent details an invention for a layered energy storage device, specifically a capacitor, built using a metal-insulator-metal (MIM) configuration.
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Discrete CNF-MIM
The Discrete CNF-MIM patent family is covering a method for manufacturing of discrete capacitor components based on our CNF-MIM technology. The innovation exploits the extra-ordinary surface to volume ratio provided by carbon nanofibers to create a MIM capacitor with unparalleled high capacitance density.
Read moreDiscrete CNF-MIM
Compact Energy Storage Interposer
The Compact Energy Storage Interposer family is covering the invention and manufacturing of extremely thin energy storage devices embedded in an interposer.
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This is Smoltek
What are carbon nanofibers? How can they be used in the semiconductor industry? What is the role of Smoltek? The answers are given in this short, informative video.
Read moreThis is Smoltek
Assembly platform
The Assembly platform family is a particular application in the field of interconnects and heterogeneous integration.
Read moreAssembly platform
Interposer
The Interposer family is covering Smoltek's CNF-MIM capacitors technology and various use cases for the same, primarily in the field of interposers for advanced packaging and heterogenous integration of semiconductors.
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Carbon Nanofibers (CNF) for Enhanced Solder-based Nano-Scale Interconnects and Packaging Solutions
Research paper in the proceedings of Semicon Taiwan 2014.
Read moreCarbon Nanofibers (CNF) for Enhanced Solder-based Nano-Scale Interconnects and Packaging Solutions
Carbon Nanofibers (CNF) for enhanced solder-based nano-scale integration and on-chip interconnect solutions
Research paper in the proceedings of 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, pp. 1071–1076.
Read moreCarbon Nanofibers (CNF) for enhanced solder-based nano-scale integration and on-chip interconnect solutions
Embedded Fibers Enhance Nano-Scale Interconnections
Research paper published in the IPC APEX EXPO Conference Proceedings, March 23–27, 2014.
Read moreEmbedded Fibers Enhance Nano-Scale InterconnectionsIs it time to Reinforce In-package Solder Joints Using CNF?
Article published in MEPTEC Report, Volume 18, Issue 1.
Read moreIs it time to Reinforce In-package Solder Joints Using CNF?